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$U513

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From Uruguay

Solder Paste No Clean Silver Tin Lead Paste, Soldering Flux Paste For PCB/IC/BGA/SMD CELLPHONE CPU Repairing(20G)

4.7
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Product ID: 525554342
Brand:
essmetuin
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About the item

🔧 Solder Like a Pro – Elevate Your Repair Game! Contains lead; handle with care for optimal safety. Ideal for BGA, SMD, and a variety of electronic repairs. Lightweight and portable, perfect for on-the-go repairs. Experience the perfect blend of alloy for superior soldering. Push-type design ensures smooth flow and zero waste. Melting Point 183℃ 10.8% Flux 62.8% Tin The Essmetuin Solder Paste is a high-performance, no-clean soldering solution designed for precision repairs in electronics. With a unique alloy composition and a user-friendly push-type design, this 20G paste is perfect for BGA, SMD, and various household and industrial applications. Its medium temperature melting point of 183℃ ensures effective soldering while minimizing waste.
  • Essmetuin Solder Paste Content: Alloy Tin 62.8% Pb 36.8%Ag0.4%, Solder Flux Content: 10.8%.
  • Lead-Containing Solder Paste - Medium Temperature Solder Paste With Flux, Melting Point: 183℃ (361F).
  • Product Advantages: Push-Type Design, Smoother Flow, And No Waste During Welding.
  • Widely Used In BGA /SMD Circuit Board,Motors, Lighting, IC, TV and Other Household Appliances And Industrial Equipment,Sensors, Wires, Fuses, Phone,Metal Shells, Motors, Lighting, Connectors, ,SMT Maintenance.
  • Warning:This Product Contains Lead, A Substance Known To The State Of California To Cause Cancer Or Birth DE-Fects Or Other Reproductive Toxicity. For More Information, Go To WWW.P65WARNINGS.CA.GOV.
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